looks like some one is trying to cover up a mistake the gold and copper will beacon one. but if this was for a ni peeler ??????? > -----Original Message----- > From: Ed Cosper [SMTP:[log in to unmask]] > Sent: Monday, July 26, 1999 12:09 PM > To: [log in to unmask] > Subject: Re: [TN] NI/AU UNDER BETWEEN COPPER > > hmmmm.... good question. and I have no clue as to reliability. I wonder > why > someone would do that in the first place unless it was reworking a > mistake. > This is a new one on me. > > Ed Cosper > > > -----Original Message----- > From: [log in to unmask] <[log in to unmask]> > To: [log in to unmask] <[log in to unmask]> > Date: Monday, July 26, 1999 1:12 PM > Subject: [TN] NI/AU UNDER BETWEEN COPPER > > > >I just looked at a product where the manufacturer has managed to > >overplate nickel/gold with copper. This occurs on the surface conductors > >and also in holes. > > > >I have looked in the design and board documents, but cannot find anything > >that addresses the reliability of such a condition. I know putting a > >"meltable" > >material between layers of copper can wreak havoc, but what about > >ni/au? > > > >Susan Mansilla > >Robisan Lab > > > >############################################################## > >TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > >############################################################## > >To subscribe/unsubscribe, send a message to [log in to unmask] with > following > text in > >the body: > >To subscribe: SUBSCRIBE TECHNET <your full name> > >To unsubscribe: SIGNOFF TECHNET > >############################################################## > >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > >information. > >If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] > or > >847-509-9700 ext.5365 > >############################################################## > > > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information. > If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or > 847-509-9700 ext.5365 > ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################