Hi Bernhard, To my knowledge, an I am the chair of the IPC Reliability Committee, there is no document that addresses the reliability of embedded/potted electronics, either THT or SMT. Certainly, the recommendations made in IPC-SM-785 for accelerated testing are useful in your situation; you just will not be able to use the acceleration factors. The possible problems posed by potting compounds have to do with their CTE, their cure temperature [which sets the initial stress conditions (you want compressive on the solder joints and a cure temperature higher than the highest operating temperature)], and the operational temperature excursions (severity and number). These parameters will determine what accelerated test conditions should be used and if there is an acceleration factor that can be applied. Werner Engelmaier Engelmaier Associates, L.C. Electronic Packaging, Interconnection and Reliability Consulting 7 Jasmine Run Ormond Beach, FL 32174 USA Phone: 904-437-8747, Fax: 904-437-8737 E-mail: [log in to unmask], Website: www.engelmaier.com