Hi all, I was just reading a paper which was comparing the solderability of different surface finishes. In it the show electroless nickel/ immersion gold to have a wetting force of 0 uN/mm at "2 sec" just after fabrication. this value becomes negative i.e -0.1 to -0.2 after reflow ect.... What does this mean? Does this mean that solder is actually repelled by Ni/Au finish? Is this only due to the short duration (2sec.) that the dip occurred? Does the value become positive; at say 5 seconds ? How does this affect a surface mount assembly, will parts be displaced prior to soldering? I was under the impression that gold was highly solderable......................I need help, but will settle for answers...............Paul Brown ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################