Hi all,
I was just reading a paper which was comparing the solderability of
different surface finishes. In it the show electroless nickel/ immersion
gold to have a wetting force of 0 uN/mm at "2 sec" just after
fabrication. this value becomes negative i.e -0.1 to -0.2 after reflow
ect.... What does this mean? Does this mean that solder is actually
repelled by Ni/Au  finish? Is this only due to the short duration
(2sec.) that the dip occurred? Does the value become positive; at say 5
seconds ? How does this affect a surface mount assembly, will parts be
displaced prior to soldering? I was under the impression that gold was
highly solderable......................I need help, but will settle for
answers...............Paul Brown

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