Hi, Typical 100-200 uin depending on the surface roughness of CuBe. The smoother the low the Ni. Au should be porious in not the Ni must be smooth. Richard Haynes 609-497-4584 -----Original Message----- From: Henry Kruckeberg <[log in to unmask]> To: [log in to unmask] <[log in to unmask]> Date: Thursday, June 10, 1999 12:42 PM Subject: [TN] Ni. Plating >Does anyone have any info on the optimum Ni. thickness to prevent base metal >migration in a electro deposited AU. over Ni. on beryllium copper application. > >Any input appreciated > >################################################################ >TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c >################################################################ >To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: >To subscribe: SUBSCRIBE TechNet <your full name> >To unsubscribe: SIGNOFF TechNet >################################################################ >Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. >For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 >################################################################ > > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################