Narayana,

I don't know if I would consider myself as a techie, but I've done a lot of
R&D work with flex photoimageable solder mask where Motorola (automotive) was
the customer.  I'm familiar with both liquid and dryfilm products over
standard laminate, and over adhesiveless.

To answer your questions:
Shrinkage during lamination - This was never an issue.
Adhesive squeeze out - There is none with photoimageable products.
Coverlay registration - Registration is increased 3 fold.  Tight surface
mount with dams become possible.

If the soldermask can survive the environment of the finish circuit (i.e.,
high humidity or temp.), it is the only way to go.


Please feel free to call me at (612) 825-6113 or I can be e-mailed at
[log in to unmask]

Scott Griggs
Regional Sales Mgr.
RBP Chemical Corp.

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