Can anyone provide some information on the questions listed below: 1. - Are there any specifications (IPC or other) which should be referenced in the PCB fabrication drawing for NiAu finishing? 2. - At what point during fabrication is NiAu normally applied - before or after LPI soldermask (or both)? If both, what are pros / cons of each? Is it important to outline desired Fab processing in the fabrication drawing? 3. - What sources of NiAu info are available on the web? Thanks, Dave Schaefer PWB Design Technical Lead NORTEL Broadband Wireless Access 14 Fultz Boulevard Winnipeg, MB R3Y 1V3 Phone: (204)631-2298 ESN 771 ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################