Can anyone provide some information on the questions listed below:

1. - Are there any specifications (IPC or other) which should be referenced
in the PCB fabrication
      drawing for NiAu finishing?

2. - At what point during fabrication is NiAu normally applied - before or
after LPI soldermask (or both)?
      If both, what are pros / cons of each?  Is it important to outline
desired Fab processing in the
      fabrication drawing?

3. - What sources of NiAu info are available on the web?


Thanks,

Dave Schaefer
PWB Design Technical Lead
NORTEL Broadband Wireless Access
14 Fultz Boulevard
Winnipeg, MB   R3Y 1V3

Phone:      (204)631-2298    ESN 771

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