hi,

see ansi/ipc-d-275 paragraph 4.8.1 has it all.

phil crepeau

-----Original Message-----
From: Aric Anderson [mailto:[log in to unmask]]
Sent: Monday, June 14, 1999 12:55 PM
To: [log in to unmask]
Subject: [TN] Mod Wires in Circuit Board Assemblies


Hello to All,


I am looking for anyone who has knowledge of any standard on Mod Wires
besides IPC 610B, IPC-771,7721 or IPC-700.

These standards only cover briefly about the particular item I am
looking for, which is STAKING MOD WIRES.

Particularly, how close one can place glue to a solder joint or
component.  If it can touch these or lay on top of or any other
situation.

If anyone has any experience in this area or has any opinions, your
response would be much appreciated.

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