Hi Charles I agree with Werner. A fast test is not an accelerated test. Due to the metallurgical properties of tin based alloys the possibilities of accelerating a thermal cycling test are limited. Got some hints in a paper: "The Deformation Behaviour of Sn62Pb36Ag2 and its Implications on the Design of Thermal Cycling Tests for Electronic Assemblies," IEEE's Transactions on Electronic Packaging Manufacturing. January 1999 Vol. 22, no. 1,Pp. 71-79 With vibration tests we are always very cautious. If a customer wants a norm test we do it. However, these are always qualitative tests. I wouldn't have the courage to use these data to make a prediction of lifetime. In SMT it is usually not the accelerating forces that lead to a failure of the solder joints but the bending of the PCB if the assembly tested is in resonance. Hence the problem is not the geometry of the components but the whole structure of the assembly, how it is fixed, the direction of the load relative to the PCB and the frequency or the frequency spectrum if random vibrations are applied. Because of these reasons we usually try to gather as much information as possible and whenever possible we measure the vibrations occurring in the application before we start vibrations. Best regards Guenter ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################