We currently run BGAs through a single sided process. We do mixed technology but handle the pinthrough via paste-in-hole. The question was posed to me whether subsequently running the boards across the solder wave hurt the joint any. I'm looking at what does the industry to do qualify so I can do a "heads up" comparison between ones that have gone over the wave against one that doesn't. I'm looking for some direction. [log in to unmask] on 06/11/99 05:02:57 PM Please respond to [log in to unmask]; Please respond to [log in to unmask] To: [log in to unmask] cc: (bcc: Jason Smith/Lex/Lexmark) Subject: Re: [TN] BGA reliability testing In a message dated 06/11/1999 2:48:37 PM US Eastern Standard Time, [log in to unmask] writes: > What does the industy do for qualifications and reliability for BGAs? What > testing is generally done. I'm trying to see if a BGA connection is > affected in any way by going through the wave solder for qualifying that in our process. > Any insight would be helpful. Whenever the word "qualification" is used, it begs the question "Qualification to what standard"? To my knowledge, there is no IPC (or other organization) that specifically covers qualification of a BGA attach process. J-STD-001, revision B, when modified with a little engineering insight and use of a suitable test vehicle, could be used. Do you have internal workmanship standards or quality control provisions that your are trying to meet? Doug Pauls Technical Director CSL ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################