Known by many names, such as Pin-In-Paste or Intrusive Reflow, it's a proven process in wide use which we often use here. Though best suited for simple, low mass parts such as headers, it can be applied to many other connector/component applications. There are a few key points to consider: - Can the connector (or component) take reflow temps without 'meltdown' or internal damage? - Can you get the connector hot enough to fully reflow all the paste without cooking the rest of the parts? - Is there adequate area at the pads to overprint enough paste to meet applicable IPC barrel fill requirements? - If not, will you (or your customer) accept less than IPC based on cross sections and pull tests to demonstrate electrical and physical integrity of the joint? There are a variety of resources available on the topic, here's a few to get you started: http://www.bobwillis.co.uk/pihsheet.doc http://www.itm-smt.com/column15.html http://www.amp.com/product/articles/dd66.html In addition, search through the TechNet archives using 'Intrusive Reflow' as the keyword, all sorts of stuff will pop up.... Mike McMonagle PCA Process Engineering Supervisor K*Tec Electronics 1111 Gillingham Lane Sugar Land, TX 77478 (281) 243-5639 Phone (281) 243-5539 Fax [log in to unmask] > -----Original Message----- > From: Cathel, Paul [SMTP:[log in to unmask]] > Sent: Thursday, June 03, 1999 7:28 AM > To: [log in to unmask] > Subject: [TN] Solder Paste in through hole > Importance: High > > Hi all, > > Does anyone have experience in soldering through hole connectors by > applying > solder paste with a stencil and reflowing in a forced convection > reflow > oven? > > > Paul Cathel > > Senior Production Eng. > > Lockheed Martin > > Moorestown, NJ > > 609-722-3441 > > [log in to unmask] <mailto:[log in to unmask]> > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV > 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > ################################################################ > Please visit IPC's web site (http://www.ipc.org) "On-Line Services" > section for additional information. > For technical support contact Hugo Scaramuzza at [log in to unmask] or > 847-509-9700 ext.312 > ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################