Hi Technetters

I have to consider and to take decision about the reliability of embeded
(potted) assembled PCB's (THT and SMT). To evaluate the solder joint
(and componenet) reliability I intend to perform thermal cycles (no
load). IPC-SM-785 defines such cycling tests, but it seems Conformal
Coating has been only with secondary importance and Embeding /Potting is
not mentioned.

Can anyone tell me if there is an IPC or other document handling the
reliability of embedded/potted electronics (especially after thermal
cycling/lifetime)?

At the good old MIL-world the Requirement 47 of MIL-STD-454K (a old
version, I know) adresses some MIL-Std's (MIL-I-16923, MIL-M-24041,
MIL-I-81550 etc.) for this purpose. Now I'm looking after equivalentes
at the IPC-world (or J-STD)

Bernhard
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