Hi Technetters I have to consider and to take decision about the reliability of embeded (potted) assembled PCB's (THT and SMT). To evaluate the solder joint (and componenet) reliability I intend to perform thermal cycles (no load). IPC-SM-785 defines such cycling tests, but it seems Conformal Coating has been only with secondary importance and Embeding /Potting is not mentioned. Can anyone tell me if there is an IPC or other document handling the reliability of embedded/potted electronics (especially after thermal cycling/lifetime)? At the good old MIL-world the Requirement 47 of MIL-STD-454K (a old version, I know) adresses some MIL-Std's (MIL-I-16923, MIL-M-24041, MIL-I-81550 etc.) for this purpose. Now I'm looking after equivalentes at the IPC-world (or J-STD) Bernhard [log in to unmask]