Instead of using 8/8 I have used 8/7. There shouldn't be any cost premium to the board fab and you can use a 5 mil grid for routing. >From: PCB Design Division <[log in to unmask]> >Reply-To: "DesignerCouncil E-Mail Forum." <[log in to unmask]>, >PCB Design Division <[log in to unmask]> >To: [log in to unmask] >Subject: [DC] Grid Settings >Date: Thu, 24 Jun 1999 10:55:49 +0300 > >Dear Experts >Can anyone tell what suitable grid settings to use when designing >boards, which have shrink DIP components (70 mil) and standard DIP(100 >mil) and SMT components on the same board. I have read that IPC has >announced taking the 0.5mm as a standard grid. But I think this won't be >applicable in our case (isn't it?). >I have read a lot about grid settings, but till now I don't see the >point behind caring so much about it. What problems could occur when you >go down to 0.05mm grid. >BTW we are using 8 mil (track/gap). >Any input would appreciated. > >-- >Best Regards ``` >Khaled H. Fouad (o o) >==============================================oOO--(_)--OOo============ >Senior PCB Designer |Tel.: +20 (11) 333414 Ext. : 312 >Research & Development Department |Mobile : 010 140 5324 > |Fax. : +20 (11) 335613 >International Electrical Products |WWW : http://www.bahgat.com >Member of BAHGAT Group |Email : [log in to unmask] >Second Industrial Zone, Plot 240 | > 6 October City, Egypt | >======================================================================= > _______________________________________________________________ Get Free Email and Do More On The Web. Visit http://www.msn.com