Dear Sunil,
the same problem has been found in our company, and we solved it though below mentioned methods.
1) increase pre-heat tempreture to 160¡æ
2)increase the spraying flux
3)only use single wave solder, not double wave solder
Best Regards
Qu Zenglong
Industrial Engineering Department
Production Division
BISC, China
Tel: 0086-10-64346323
Fax:0086-10-64367731
e-mail: [log in to unmask]
----------
From: Sunil Gupta[SMTP:[log in to unmask]]
Reply To: TechNet E-Mail Forum.;[log in to unmask]
Sent: Wednesday, May 05, 1999 11:49 AM
To: [log in to unmask]
Subject: [TN] Icicle formation on wave soldering
While wave soldering the mixed technology boards I am facing the problem of
icicles being formed on the solder side. The icicles are only on SMDs
(capacitors and resistors, there are no other SMDs) while not observed on
lead thru components. The machine parameters are:
Bath temperature: 245 deg C
Conveyor speed: 1m per minute
Fluxing thru foam fluxer
PCB temperature before soldering: 100 deg C
Preheat zone length: 1.5 m
The problem got solved by heating the boards at 60 deg C and than passing
them thru the fluxing and soldering.
I want to eliminate the Icicle problem and also remove the requirement of
baking.
Can you give me ideas.
regards
Sunil Gupta
Manager Process Engineering
Tata Telecom Ltd.
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