Dear Rich, We are a major oxide supplier and I can tell you that our major customers use our DMAB reduction post dip with our oxide. We introduced this process back in the early nineties and I believe it is now considered the norm. We have recently introduced our Cirbond process and an alternative to oxide reduction. This product has a much shorter cycle time, lower cost, and it provides a much more resilient surface. It can easily be conveyorized as well. I can provide you additional information as well if you want at call me at 1-800-877-9871 ext 209. Regards, Chris McGary Dexter Electronic Materials ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################