I have always looked at page 56, and the special conditions that apply when leads are clipped, as a strong "hint" to avoid lead cutting at almost all costs. Why else would it be "required" that you either inspect all leads at 10X or reflow all cut leads? And the statement "evidence of fracture" is wide open to interpretation. I think your clear challenge is to find an effective way to pre-trim/pre-form any application that allows you to avoid post-solder cutting. I am confident you will hear from others who have an extremely effective trimming operation. Remember though, this is the exception. I still find it unlikely that any manufacturer can do this without producing at least some "evidence of fractures". Just an opinion, Sean PS. It wasn't quite clear whether you were soldering these wires into a PCB or another application. If these stranded wires are soldered into a PTH application, you will also need to consider the strict controls required to do this in a repeatable and reliable manner. Please reply if you'd like to open this discussion also. From: Bob Arciolla <[log in to unmask]> on 05/03/99 02:42 PM GMT Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to Bob Arciolla <[log in to unmask]> To: [log in to unmask] cc: (bcc: Sean Hager/US/Centigram) Subject: [TN] Fractured joint clarification Good Morning, I am the Quality Manager at Endicott Research Group in Endicott New York. I have a question regarding fractured joints. On page 56 of IPC 610 it refers to lead cutting. Our operators are cutting leads on stranded wires. The solder fillet around the wire lead is fine. The top area where the cut is made reveals a fracture line and in some instance you can see where the strands have been seperated from each other. Some wires show a clean surface cut. Is the fracture line on the top side of the wire an acceptable condition? Is this a problem waiting to happen if it isn't reflowed? Any help would be greatly appreciated. Bob Arciolla [log in to unmask]