I wish I could remember all I forgot on this subject. I do
remember wishing I could count on normal copper oxidation
to do the job other processes should.

In my polyimide days, cuprous (is this the red stuff) was
used over cupric (is this the black stuff) to promote
inner laminar bond during relamination. Has double treat
(brass plating copper foil?) fulfilled its promise?

I guess I'm asking more questions than providing answers. I'm
just suprised the question persists.

Another frustration I have is when did the customer specify
a process? What happened to concurrent engineering. The master
drawing and specification used to call out only what was
acceptable - not how to make it happen.

Earl Moon

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