Steve: Thanks for your explanation of IPC's activities on BGA voiding. Just two 'small' questions (maybe 'big' answers??): i./ Is that 20-30% by cross-sectional area, or volume, or what? ii./ Is there any comment also about WHERE the voids are located - solder/UBM or solder/pad? Ta, Andy ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################