Sorry, but Uniplate does not utilize palladium. I have their literature and it specifically states NO palladium....rather it uses a conductive polymer (non metal).... However, that aside, what I am more interested in is feedback, anecdotal or otherwise, from those who have used it/ heard about its pros/cons, know other who have used it, know of any other conductive polymer process similar to Uniplate.... Dave At 11:14 PM 5/18/99 +0100, Paul Brown wrote: >The Uniplate process is a conductive polymer based on palladium as the final >conductive layer >The palladium is ionic and reduced to con the hole walls >-----Original Message----- >From: David Pizzoferrato <[log in to unmask]> >To: [log in to unmask] <[log in to unmask]> >Date: 18 May 1999 22:39 >Subject: Re: [TN] Conductive Polymer > > >>No, I am not referring to screen printed conductive inks. What I am >>referring is a replacement for electroless copper. A means by which to >>sensitize the drilled hole wall in order to accept subsequent electroplate >>copper. Specifically, conductive polymer process (Uniplate/Autotech) . Not >>to be confused with carbon based "SHADOW" or "BLACK HOLE" technology. >> >>Regards >>Dave >> >> >> >>At 10:07 PM 5/18/99 +0100, Paul Brown wrote: >>>When you say conductive polymer do you mean screen printed conductive inks >>>or palladium type processes >>>at my last company we developed and installed a number of "direct plate >>>installations " to replace electroless copper. This system was based on a >>>reduced palladium conductive film, not a conductive organic layer >>>Do you want more info >>>Regards >>>Paul Brown >>>(UK 10pm, raining and cold (8'C)) >>>-----Original Message----- >>>From: Fred S. Shubert <[log in to unmask]> >>>To: [log in to unmask] <[log in to unmask]> >>>Date: 18 May 1999 21:50 >>>Subject: Re: [TN] Conductive Polymer >>> >>> >>>>I would be very interested in reading this paper. Could you possibly >>>compact >>>>it and send it via e-mail? Or would you send it to me at: >>>> >>>>Fred Shubert >>>>Kester Solder >>>>2105 60th. Ave. Dr. E. >>>>Bradenton, FL. 34203 >>>> >>>>If that is not possible please let me know where I can obtain a copy. >>>> >>>>----- Original Message ----- >>>>From: Jason Smith <[log in to unmask]> >>>>To: <[log in to unmask]> >>>>Sent: Tuesday, May 18, 1999 3:08 PM >>>>Subject: Re: [TN] Conductive Polymer >>>> >>>> >>>>> I wrote such a paper along those lines, but it's too big (due to >>>graphics) >>>>to >>>>> send over net. >>>>> >>>>> >>>>> >>>>> [log in to unmask] on 05/18/99 12:50:09 PM >>>>> >>>>> Please respond to [log in to unmask]; Please respond >>>to >>>>> [log in to unmask] >>>>> >>>>> To: [log in to unmask] >>>>> cc: (bcc: Jason Smith/Lex/Lexmark) >>>>> Subject: [TN] Conductive Polymer >>>>> >>>>> >>>>> >>>>> >>>>> Hi all, >>>>> >>>>> I am looking for commentary (pro and con) on conductive polymer as a >>>>> replacement for electroless copper. (not to be confused with carbon >based >>>>> technology i.e. Shadow, Black Hole etc.) >>>>> >>>>> More specifically I am looking for feedback on Uniplate. Reliability, >>>>> process robustness, general acceptance by assemblers/customers, I >>>>> appreciate all comments. >>>>> >>>>> Regards, >>>>> Dave Pizzoferrato >>>>> >>>>> ################################################################ >>>>> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV >>>1.8c >>>>> ################################################################ >>>>> To subscribe/unsubscribe, send a message to [log in to unmask] with >>>>following text >>>>> in the body: >>>>> To subscribe: SUBSCRIBE TechNet <your full name> >>>>> To unsubscribe: SIGNOFF TechNet >>>>> ################################################################ >>>>> Please visit IPC's web site (http://www.ipc.org) "On-Line Services" >>>>section for >>>>> additional information. >>>>> For technical support contact Hugo Scaramuzza at [log in to unmask] or >>>>847-509-9700 >>>>> ext.312 >>>>> ################################################################ >>>>> >>>>> 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unsubscribe: SIGNOFF TechNet >>>################################################################ >>>Please visit IPC's web site (http://www.ipc.org) "On-Line Services" >>section for additional information. >>>For technical support contact Hugo Scaramuzza at [log in to unmask] or >>847-509-9700 ext.312 >>>################################################################ >>> >> >>################################################################ >>TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c >>################################################################ >>To subscribe/unsubscribe, send a message to [log in to unmask] with following >text in the body: >>To subscribe: SUBSCRIBE TechNet <your full name> >>To unsubscribe: SIGNOFF TechNet >>################################################################ >>Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section >for additional information. >>For technical support contact Hugo Scaramuzza at 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