In a message dated 05/04/99 06:46:26PM, [log in to unmask] writes: SNIP > Are you sure gold embrittlement is really a problem? I don't recall having > ever seen any metallurgical reports that say what Au does in Sn96/Ag3.5, so > I'm not sure that its limitations are the same as those of Sn63 and similar. > I do recall having worked with the Sn96/Ag3.5 and similar solders years ago > and producing some of the ugliest solder joints ever conceived, in a > cosmetic > sense. The solder joints were quite strong and did the job intended. Sn96 is more tolerant of Au than Sn63 under the same conditions. Approximately: The problem of gold embrittlement is the ratio of Au to Sn, as there is 50% more Sn in the SN96, the gold leached into the joint will be 2/3 the level (with respect to the tin) compared to the same amount (of Au) in a Sn63 joint. Mike Fenner ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################