Our experience has been that the solvent swell in a permanganate desmear system tends to go after the CB-100 a bit too much. It will swell out causing positive bumps on the surface of the board. I'm sure we could have adjusted dwell, or otherwise worked through the problem, but since we have plasma available, that seemed like the most expedient solution. Andy ______________________________ Reply Separator _________________________________ Subject: Re: [TN] Blind Via Adhesion Author: Lourdes Mertens <[log in to unmask]> at smtplink-hadco Date: 04/25/99 5:53 AM Andy, When using CB-100, why do you prefer plasma at desmear process? Lourdes >>> Andy Slade <[log in to unmask]> 04/23 5:08 AM >>> Hi Mike, The only way we were able to get this under control was to do a flash plate immediately after electroless copper dep. I am assuming that you are taking the panels through a permanganate desmear, prior to dep. If you are using plasma alone, this does not provide enough surface topography. Another option, but it's a costly one, is to pre-fill the vias with something like DuPont CB-100. This accepts metalization better than pure resin. Need to use caution at desmear - must use plasma only. Hope this helps...Andy ______________________________ Reply Separator _________________________________ Subject: [TN] Blind Via Adhesion Author: Mike Bailey <[log in to unmask]> at smtplink-hadco Date: 04/22/99 9:01 AM Got an age old problem. Maybe there are some new solutions. We're building some conventional sub-assy blind via boards that have via in pad configurations. No big surprise, the electroless copper adhesion on the resin-fill areas is blistering. Re-design using laser drilling is not an option, nor is direct plate technology or plasma. We have tried the usual pre-electroless copper bake as well as post-bake, mechanical scrubbing etc. etc. I'm a little hesitant to play with additional desmear tactics as they have a tendency to or smooth out the original surface texture. Also as usual, I don't have much time. Material is conventional 140 Tg epoxy Hole dia. is .0118. Yes, some surface sanding is required after final lamination (just like the rest of you guys)!! Any ideas? ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. 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