Hi, sorry to get in between. You seem to discuss what is hot also here at our company to and from. My first question would be: please, gentlemen, what are you from Chuck and pupil? I have got some good advice from Dave at Rockwell, maybe we have something good to learn from you too. I have tried for one year to buy an american plasma cleaner, but when the economists ask "what is the payback time" , then what can I answer? Oh, my adrenaline...! /Regards Ingemar Hernefjord Ericsson Microwave Systems > >Date: Tue, 20 Apr 1999 19:09:41 -0400 > >To: [log in to unmask] > >From: joyce <[log in to unmask]> > >Subject: Re: [TN] Wire Bonding On Gold > > > >(1) If you have good plating, you don't need any physical abrasion. > >(2) you can use eraser if the surface of Au is not clean, but make sure it > has no/low ionics (such as Sulphur- common additive for rubber). > >(3) you can use brush > >(4) depend on your process and product, you may be able to use plasma > too...However, if your plating surface required eraser to remove the top > surface, the plasma normally would not do the trick.. Plasma is great to > remove MINOR oragnic residue. > >(5) if your gold is too hard (impurity or voids concentration are high), > you will have problem to bond and have reliability problem. (eraser, brush, > plasma are not going to help you). > >good luck. > >jk > >At 06:29 AM 4/20/99 EDT, you wrote: > >>We are presently wire bonding aluminum wire to gold lands on circuit boards. > >>I have heard many times that wire bonding goes sour to clean them with an > >>eraser. This seems a little primitive. Is there any other way that this can > >>be accomplished. > >>If the eraser works why hasn't someone designed something to take care of > >>this. > >>Chuck Garth > >> > >>################################################################ > >>TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c > >>################################################################ > >>To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in the body: > >>To subscribe: SUBSCRIBE TechNet > >>To unsubscribe: SIGNOFF TechNet > >>################################################################ > >>Please visit IPC's web site (http://www.ipc.org) "On-Line Services" > section for additional information. > >>For technical support contact Hugo Scaramuzza at [log in to unmask] or > 847-509-9700 ext.312 > >>################################################################ > >> > > > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with following text > in the body: > To subscribe: SUBSCRIBE TechNet > To unsubscribe: SIGNOFF TechNet > ################################################################ > Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for > additional information. > For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 > ext.312 > ################################################################ > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################