Tracy, I'm sure you'll get a plethora of email on this subject. However you didn't state if your boards were electroless or additive plated. I have found: Most important is the ability of the supplier to drill economically i.e. stack multiple boards when drilling. The issue with this is drill wander, having a target pad large enough hit repeatedly with minimum breakout if allowed. The Aspect ratio of the "hole to board thickness" is next most important due to the ability of the supplier to plate the barrel of the hole. With high aspect ratio holes the barrel can get unevenly plated similar to the shape of an hour glass. This leads to barrel breakage. I've used holes that were .014" drilled, finished to .010" in a .022" land that was produced successfully and economically in .040" to .062" thick boards. I've found that suppliers prefer a minimum of .004" per side metal land for drilling. Talk with your board supplier and ask what their process is. Explain what your design intent is. They'll give you their best response for design rules that will meet your needs and their process. Good luck! Mike -----Original Message----- From: Tracy Black [mailto:[log in to unmask]] Sent: Tuesday, April 06, 1999 8:33 AM To: [log in to unmask] Subject: [TN] Coax to P.C. board mounting Hi all you valuable TechNet'ters: My company makes very small coax type push-on connectors for P. C. board applications among others. I would like to know if there is a standard size pad for a given through via size? The next question would be what would happen if, for electrical reasons I could not comply with the recommendation? My via size is about .015" and I am designing a solder application for a customer so that they can absolutely minimize the spacing between boards. I have only been in this business a few years so I am trying to learn the little tricks to the trade or maybe it's better stated as the exceptions to the rule.. T. Black ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################