Dear Art, You are completely right. However, immersion gold and electroplated gold give different story. Thick gold from immersion gold process has the worse effect for solderability. ____________________________________________________________ At 07:48 AM 1999/4/28 -0500, Art Fisher wrote: >You might want to add a little about gold plating. Gold in itself does >NOT bond to solder. It does, however, protect against oxidation. The >gold plating has to be very thin, on the order of 2 - 3 micros. The >solder actually goes through the gold to bond to the surface underneath. >If the gold layer is too thick, the components will just fall off. We >had a board house plate the pads with a thicker layer used with edge >connectors, and most of the components just fell off. You have to be >very careful with the process. >Art > >> -----Original Message----- >> From: Albert Mok [SMTP:[log in to unmask]] >> Sent: Wednesday, April 28, 1999 7:40 AM >> To: [log in to unmask] >> Subject: Re: [TN] Flash Gold?? >> >> Dear technetters, >> >> We regard "flash gold"for gold thickness up to 2 microinch. The >> purpose of >> gold flash is to give protection of nickel against oxidation and also >> provide better solderability when compared with bare nickel. Flasg >> gold is >> very common for COB boards and the whole board will be electroplated >> for >> maximum 2 microinch. >> >> _____________________________________________________________ >> >> >> At 06:58 AM 1999/4/27 -0700, David McCann wrote: >> >We have used flash gold on rigid flex products to maintain a >> solderable >> >surface. Typically I have seen approximately 4 microinches of Au (ie >> flash >> >Au referring to a very thin electroless plating), over 100 >> microinches >> >minimum of electroless Ni over Cu. >> > >> >Regards, >> > >> >-----Original Message----- >> >From: TechNet [mailto:[log in to unmask]]On Behalf Of Nick Liang >> >Sent: Monday, April 26, 1999 11:41 PM >> >To: [log in to unmask] >> >Subject: [TN] Flash Gold?? >> > >> > >> >All: >> >What is Flash Gold Process?? >> > >> >Thanks for your answers. >> > >> >----------------------------------------------- >> >Nick Liang >> >QE Engineer >> >Quality Assurance Division >> >Gold Circuit Electronics Ltd. >> >Tel : (886) 03-4612541 Ext 417 >> >Fax: (886) 03-4522094 >> >Cell: (886) 0935-917151 >> >E-Mail : [log in to unmask] >> >------------------------------------------------ >> > >> >################################################################ >> >TechNet E-Mail Forum provided as a free service by IPC using LISTSERV >> 1.8c >> >################################################################ >> >To subscribe/unsubscribe, send a message to [log in to unmask] with >> following >> >text in the body: >> >To subscribe: SUBSCRIBE TechNet <your full name> >> >To unsubscribe: SIGNOFF TechNet >> >################################################################ >> >Please visit IPC's web site (http://www.ipc.org) "On-Line Services" >> section >> >for additional information. >> >For technical support contact Hugo Scaramuzza at [log in to unmask] or >> >847-509-9700 ext.312 >> >################################################################ >> > >> >################################################################ >> >TechNet E-Mail Forum provided as a free service by IPC using LISTSERV >> 1.8c >> >################################################################ >> >To subscribe/unsubscribe, send a message to [log in to unmask] with >> following text in the body: >> >To subscribe: SUBSCRIBE TechNet <your full name> >> >To unsubscribe: SIGNOFF TechNet >> >################################################################ >> >Please visit IPC's web site (http://www.ipc.org) "On-Line Services" >> section for additional information. >> >For technical support contact Hugo Scaramuzza at [log in to unmask] or >> 847-509-9700 ext.312 >> >################################################################ >> > >> > >> > >> >> ################################################################ >> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV >> 1.8c >> ################################################################ >> To subscribe/unsubscribe, send a message to [log in to unmask] with >> following text in the body: >> To subscribe: SUBSCRIBE TechNet <your full name> >> To unsubscribe: SIGNOFF TechNet >> ################################################################ >> Please visit IPC's web site (http://www.ipc.org) "On-Line Services" >> section for additional information. >> For technical support contact Hugo Scaramuzza at [log in to unmask] or >> 847-509-9700 ext.312 >> ################################################################ > > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################