James- I. Turlik, et al, published a number of papers which include the area of interest, in IEEE Trans. CPMT. One article readily available to me is as follows: IEEE CPMT, Vol. 16, No. 1, February 1993, "Passivation Schemes for Copper/Polymer Thin-Film Interconnections Used in Multichip Modules," by Gretchen Adema, L.-T. Hwang, Glenn Rinne, & Iwona Turlik [all MCNC, North Carolina, USA, pp. 53-59, with [25] references cited. An excerpt from the Abstract: "An investigation was conducted to examine the use of inorganic dielectric films as barrier layers between copper and polyimide..." Hope this helps. Michael Alderete Aerojet -----Original Message----- From: James Rohan [mailto:[log in to unmask]] Sent: Monday, April 19, 1999 3:27 AM To: [log in to unmask] Subject: [CHIPNET] Metal Polyimide Adhesion Does anybody have specific information about the reaction of copper with polyimide which leads to adhesion failure? Does this failure occur in the different instances of polyimide on metal and metal deposition on cured polyimide? and we would like information on the interaction of nickel and/or copper with fully cured photo spin-on polyimide and how the adhesion of either of these metals to the polyimide might be improved? Thanks, James __________________________________ James Rohan National Microelectronics Research Centre Lee Maltings Prospect Row Cork Ireland Tel. + 353 21 904224 Fax. + 353 21 270 271 http://www.nmrc.ucc.ie ################################################################ ChipNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE ChipNet <your full name> To unsubscribe: SIGNOFF ChipNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################