Davis, Once in the paste ( 5 years ago ) we use the same glue and cured at solder reflow profile. Our intention was keep 0603 components in place during reflow to avoid " tombstoning ", at that time we had a bad 0603 pad design and a lot of rejections due tombstoning, and we use glue until new 0603 pad design were aproved.No problem were found that time related with glue. Thanks Jorge Santana Process Engr Microtec - Brazil > -----Original Message----- > From: Davis Yang [SMTP:[log in to unmask]] > Sent: 7 de Abril de 1999 01:06 > To: [log in to unmask] > Subject: [TN] Can adhesive go thru reflow soldering? > > Dear Sir, > We have to put adhesive(glue) on PCBA before reflow. the adhesive > we are using is LOCTITE 3609. but the spec for the adhesive is 150C > degree with 90 - 120 Seconds. We want to know if any issue for the > adhesive to go thru reflow profile? we are worrying about potential > reliability problem. and the supplier can't give us the answer. > please give any advice on the question. > thanks a lot! > Davis > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV > 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > ################################################################ > Please visit IPC's web site (http://www.ipc.org) "On-Line Services" > section for additional information. > For technical support contact Hugo Scaramuzza at [log in to unmask] or > 847-509-9700 ext.312 > ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################