IPC Chip Scale and BGA National Symposium: The Pursuit of the Perfect Package Santa Clara Convention Center, Santa Clara, California Workshops - May 5, 1999 Tabletop Exhibits and Technical Conference-May 6-7, 1999 Popularity Pains? The now inevitable movement of Chip Scale and Ball Grid Array packaging into the electronics manufacturing infrastructure is a battle fought on many fronts. It is, as Eric Bogatin, Bogatin Enterprises, describes it, "an incredibly interdisciplinary field" where package designs, substrates, assembly process, test and inspection all interrelate. The continued popularity of these high density component packages is dependent upon a "meeting of the minds" of the semiconductor manufacturer, the packaging technologist, the printed board fabricator, the assembly engineer, and many others. Now is not the time to mind your own business! The 1999 IPC Chip Scale and Ball Grid Array National Symposium will present new substrate technology, wafer level processes, PCB design strategies, assembly and reliability data. Critical issues, such as package design for test and BGA solder joint reliability, will be explored. An OEM Applications Forum will show where CSP is headed in both market and technological terms. OEMs and everyone involved in manufacturing or supplying to the CSP/BGA assembly industry must attend this symposium. Tabletop exhibits will showcase the latest in equipment and material innovations for BGA and CSP. Workshops on May 5th will provide a more in-depth treatment of topics from substrate determination to CSP assembly reliability. If your company is interested in exhibiting at the IPC Chip Scale Ball Grid Array National Symposium, please contact Page Hecker at 510-797-5517. Tabletop space is limited. The tabletop exhibit fee includes admission for one to the technical conference. FOR A COMPLETE CONFERENCE AND WORKSHOP BROCHURE OR REGISTRATION INFORMATION, call Alex Curtis at 847-790-5377. Or, see our brochure on IPC's website (click on the link from the conference listing on the calendar May 5-7, 1999). Maryellen Hilderbrand Education Manager IPC 2215 Sanders Road Northbrook, IL 60062-6135 Phone: 847.790.5382 Fax: 847.509.9798 E-mail: [log in to unmask] URL: http://www.ipc.org ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################