Bob, One question to ask: Is the mask your using polyalcohol developable or carbonate developable? The polyalcohol types tend to be more resistant from the gold solutions that carbonate. -----Original Message----- From: Robert Jordan [SMTP:[log in to unmask]] Sent: Tuesday, March 09, 1999 11:28 AM To: [log in to unmask] Subject: [TN] Immersion Ni/Au & Solder Mask Hello Techneters, I would like to solicit you comments, experiences, suggestions and hopefully success stories concerning the processing of Immersion Nickel/Gold with respect to LPI Solder Mask adhesion. Presently, we solder mask first then send out to subcontractors for Immersion Nickel/Gold. We use Tayio PSR4000AD as well as PSR4000BN. From time to time we see peelers, leakers whatever you would like to call it. The same solder mask performs fine in HASL and Entek enviroments. I'am stumped. Are any of you runing a 6 sigma process reguarding this? Areas in question include; * Surface prep prior to LPI * LPI mask itself ...ie manufacturer? * Exposure and Development * Final Cure * Immersion Nickel/Gold Type/Manufactures Operation parameters ... ie temperature, concentrations, pH, time Thickness of Nickel deposit * Should we Immersion Nickel/Gold before mask? * Mystery or Magic? Thank You, Robert Jordan 408-738-0693 x1116 ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################