A quality organization that I work with has a number of questions concerning the use of solder pots, techniques, limits, conditions, constraints as they relate to solder shock testing of laminates. They are: I need some information concerning the expiration of 63/37 solder when used in a solder pot. I have looked for any kind of standard that would describe a time limit for the solder, but haven't found a thing. We thermally stress circuit boards at 550o F (288o C ) for ten seconds, referencing test method IPC-TM-650, Number 2.6.8., revision C, date 8/97, sections 5.4 - 5.6. But how often should we replace the solder ? Is there a time constraint or quantity constraint that dictates when to replace the solder with new material ? In addition, is there any information concerning the procedure for replacing the solder in the pot ? Is there a percentage of copper that must be added to the 63/37 tin/lead solder ? Or some other preparation needed for proper solder flow. Please respond to my e-mail address with any pertinent information that will assist me. I would also recommend adding this information to your test methods IPC-TM-650 for other industries to reference. Look forward to hear from you. Sincerely, Christopher S. Barton IBM Corporation [log in to unmask] Are there specific directions with which the testing is to be performed; side to be floated, flip coupon between floats when doing multiple tests, cool down technique, bakes before floating, etc? Thx. Stephen Ayotte, IMD Product Quality Engineer Dept. 5QE, Bldg. 14-3, Office BB11 Phone (607) 755-1537, t/l 855-1537 Pager (607) 755-7243 Pin #863 - external, 5-8888 Pin 2863 - internal Fax (607) 755-4649 ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################