All,
Does anyone out there have any reliable info on Via in pad technology in
.040mil and .062mil thk FR-4?
Has anyone used Via in pad for 20 mil BGA lands same thickness?
These BGA designs are getting so tight we need some relief!
Am looking for design rules and capability for high volume manufacturing.
Thanks,
Mike Beckman
ATD DPD Design Integration
[log in to unmask]

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################