Hi Glenn - This sets up a situation very much like the thick application of epoxy an urethane conformal coatings, back in the days of yore (or whenever it was that I had hair). The stresses which result from thermal cycling, particularly in the MIL temp range of things, can produce cracks in glass and ceramic parts. And you know where it goes from there. The second thing that can take place is solder fatigue. If sufficient epoxy material is under a part, in a manner where it is competing against the solder termination in a differential expansion situation, then there is a good possibility that you will encounter cracked solder at some point. I have also seen a number of these type imbedments, operated at normal office temperatures that survived for years without problem, including some in a ten or so year old 8088 based computer I own. Good luck - Kelly ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################