Greg, Non electrically conductive die attach materials exist. Do you require an electrical die back side connection? If not then one of these materials may help. These have ceramic, or even diamond fillers in, though the diamond ones are expensive, but have the best heat conductivity. They are available in paste form and can be processed in the same way as the silver filled adhesives. The silver filled paste manufacturer probably has an electrically insulating version. I'm afraid that manufacturings worry is real. The solder mask can have pin holes. Conductive silver epoxies can short to tracks through them. regards, J Drake Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to Greg Bodi <[log in to unmask]> To: [log in to unmask] cc: (bcc: Jeremy J Drake/HQ/CUK/Celestica) Subject: [TN] Help!! Big problem (solder resist vs die attach) Hi Designers, I'm in need of help! I have completed a design with some L157 IC's on the Board. And Manufacturing came back to me after I finished the design and was about to ship it and said that they use a conductive epoxy to adhere the die to the Board and they're worried that if the Solder Resist has pin holes in it that it could leak a signal into the runners below those Die. They said they could use Pre-Forms but that would kill their yeild so they want me to reroute the traces below those die. Unfortuatley that would be a nightmare and add at least a week to my time. So can anyone tell me where I can get info to help prove that this won't be a problem or are they right and there's a good possiblitiy that this could happen. Thank you, Greg Bodi [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################