Good afternoon Rob, 2 quick things come to mind: 1. With components already mounted on the bottom side of the board, tooling nests (fixtures, board locks, etc.,) will be required for each board type to provide support during solder paste printing. This may add additional cost in either tooling or setup/changeover. 2. Check with your adhesive mfr., to determine compatibility and bond strength after additional thermal exposure. The one side effect would be that the bond (between pcb and component) may weaken and the components will fall off during subsequent assembly and wave soldering. The mfr may suggest another formulation that could satisfy your new requirements. Personally, I would not change the current process flow to eliminate a board flip. The change seems to add additional cost/labor and uncertainty versus the board flip. Steve Sauer -----Original Message----- We are in the process of determining the most efficient way to run our smt process. Right now we only have a half line and are looking at adding the back half of the line. Our current process takes us through reflow first, flip the product, then move the product to the beginning of the line and then run the bottom side (curing). If we use this current process with the second half of the line, we will need to flip the product over before it reaches the hand insertion line. Our thoughts are can we run bottom (curing) first, flip the product, and then run top side (reflow)? This will require us to only flip the product once. Are there any issues with running curing first and then running reflow? After the glue is cured, it will be passing through the oven during reflow at a higher temperature than the curing temperature. Will the reflow temperature have any effect on the glue? Rob Williams ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################