Jorge, Let me understand you correctly. Did you say that you suspended the BGA component "live bug" (right side up) above a stainless steel plate and when the component reached reflow temperatures one or more solder balls fell off? Did this happen on more than just a few units? One sure way to fix this problem is to reball the BGA after making sure the pads are wetting properly. If these components are new then this is really Intel's problem and not yours. You may want to check the Technet archives for some of my previous BGA issues and concerns. Try searching on "Defective BGA" in the subject field. Or visit this link describing the "strikingly similar" BGA problems which we are finding: http://www.sixsigmaservices.com/defectivebga/ Regards, Russ Winslow Six Sigma 1940 Concourse Drive San Jose, CA 95131 -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Jorge Engenharia Sent: Tuesday, March 23, 1999 5:31 AM To: [log in to unmask] Subject: [TN] Bga solder ball failure. Hi technos, We run PC boards with chipset INTEL 82371EB 324 pins and 82443BX 492 pins both BGA package. First we had bad performance due solder that comes under BGA through the via holes located under the component during solder wave process. We fixed that using adesive tape to cover the via holes during solder wave. After using the tape we still had solder short only at the small BGA ( 324 pins ). We bake some boards and components to verify if humidity were causing some solder balls to splash away due high vapor formation during reflow, but the problem still happened. We run some BGA parts ( 324 pins ) above one stainless steel plate inside the oven and could observe that some balls drop off from the package and splash under the component. The 492 pins BGA came from KOREA and the 324 pins BGA came from PHILIPINES. My question: Why I had problem only at 324 pin BGA if both BGA are subject at the same process enviroment ? Anybody had already problem with this BGA from PHILIPINES ? There is one way to avoid this problem ? Any help will be very apreciated. Thanks ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################