Does anyone have information on the effect of applying epoxy around SMT components after they've been soldered? The situation arises due to space limitations on the board. A die encapsulant is used to protect wire bonds but overflows onto adjacent chip caps and resistors. Two conditions occur; fully encapsulated components, and partially encapsulated components. I have some concern with the mechanical stress that it may see at different use temperatures. But tell me if my thinking is correct here: The epoxy is cured at an elevated temperature (150 to 160 C). So, given that it is stress free at the cure temperature, at room temperature, the epoxy should be in tension. Right? Thanks for your input. This will probably result in an experiment to prove out the design. But, maybe there's some technical paper already published or personal experience that would help design the experiment. Glenn [log in to unmask] [log in to unmask] Get Your Private, Free Email at http://www.hotmail.com ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################