Ok. Save me from myself. I see one graph in one article reporting 10 gram bond pulls for thermosonic gold ball bonds on Cu/Ni/flash Pd/flash Au (equal results were reported with Pd thicknesses ranging from 3u" to 20u") and now I want to try it! This will save me from trading in all my bonders- I am hoping to use this finish on a microvia PCB I am investigating to replace an LTCC (low temp. cofired ceramic) board.

Has anyone tried this? is there any literature I should reference? and does anyone have any advice as to stage temp./power (ultrasonic)/force/dwell (time)? The board might be 1) 9 metal layer polyimide (plasma microvias), or 2) "high-temp" FR4 (175C Tg) with 130C Tg photoimageable dielectric (photo microvia) on top- several microvia layers.

I intend to have the Ni/Pd/Au added to bare copper after I have taken delivery of the boards.

Resp.
Phil Hersey, Carson City Nevada USA