MY COMPANY IS CURRENTLY CONSIDERING ADOPTING THE IPC A-610B SPEC. INTO OUR ELECTRONIC MFG ASSEMBLY. CURRENTLY WE ARE A OEM MFG OF COIL ASSY FOR THE MILITARY, AND WE ARE EXPANDING INTO ELECTRONIC PWB ASSEMBLY AREA. OUR SOLDERING SPECIFICATIONS INCLUDE MIL-STD-2000A, NBH5300, AND NASA. HOW DOES IPC  CLASS II/ III COMPARE TO THE ABOVE MENTIONED STANDARDS?". " WHAT ARE THE SIMULARITIES?" WHAT DOES IPC EXCEED OVER MY CURRENT STANDARDS?", AND " WHERE DOES IPC FALL SHORT OF ABOVE STANDARDS, IF APPLICABLE"." WHAT IS THE PERCENT OF STANDARDIZATION OF IPC IN THE ELECTRONIC MFG ASSEMBLY WORKFORCE?".
YOUR HELP IS GREATLY APPRECIATED
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