MY COMPANY IS CURRENTLY CONSIDERING ADOPTING THE
IPC A-610B SPEC. INTO OUR ELECTRONIC MFG ASSEMBLY. CURRENTLY WE ARE A OEM MFG OF
COIL ASSY FOR THE MILITARY, AND WE ARE EXPANDING INTO ELECTRONIC PWB ASSEMBLY
AREA. OUR SOLDERING SPECIFICATIONS INCLUDE MIL-STD-2000A, NBH5300, AND NASA. HOW
DOES IPC CLASS II/ III COMPARE TO THE ABOVE MENTIONED STANDARDS?".
" WHAT ARE THE SIMULARITIES?" WHAT DOES IPC EXCEED OVER MY CURRENT
STANDARDS?", AND " WHERE DOES IPC FALL SHORT OF ABOVE STANDARDS, IF
APPLICABLE"." WHAT IS THE PERCENT OF STANDARDIZATION OF IPC IN THE
ELECTRONIC MFG ASSEMBLY WORKFORCE?".
YOUR HELP IS GREATLY APPRECIATED