Hi Technetters, Refer to IPC-SM-782, which mention about robber pads to reduce solder bridging but doesn't mention about size and shape, is there any simple calculation method/rule to design a robber pad for the SOIC and TO220 package for wave soldering process? Thanks, WM Cheng [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################