Evenin' all! My question is this: My stencil printer operator has said that he has to wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch aperatures for a QFP to release well. We are using Amtech NC-559 type 3 paste with 89.5% metal. The paste is not old. I considered using type 4 paste, which has a much finer powder in it. I was told by Amtech that this finer powder paste will pack more densly into the aperatures and I could get some bridging, unless I order a new stencil with aperature reductions. Our squeegee speed is 0.6 inches/s, or 15mm/s. Is this too slow? Amtech suggested that at this slow speed, the paste could be rising out of the aperature, as if someone pressed on a wet sponge and it rose back to its original shape. What is a good squeegee speed for 20 mil pitch parts? Thanks all! Ryan Jennens TelGen Corp. ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################