Techno's Thanks Graham Collins for the suggestion. The program I am on is high tech with 25 mil technology. Approximately 1/2 of the board in component population is 0805 components. The assembly is a four layer board with through hole technology. The SMT is only on one side with the bottom side used for ICT. At the sametime we are trying to make this decision we are also changing over to No Clean paste and flux. Our experience with No Clean is very limited. We will be using Selective Solder system with No Clean flux for the through hole components. Any PPM levels you can provide would be appreciated. Thanks Donn Steffen VDO Control Systems ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################