Greg, I've seen this type of thing happen, where a silver filled die attach adhesive (probably through silver migration) shorted to traces below the die. We mostly make ceramic hybrids, so our solution was to use a couple of layers of glass encapsulant (designed for encapsulating fired resistors, and not containing any pin holes) as a die pad. The glass encapsulant does have to be fired at a high temperature (800 C or so), so it is only a solution for ceramic substrates. Brett Goldstein EVI, Inc. > Hi Designers, > > I'm in need of help! I have completed a design with some L157 > IC's > on the Board. And Manufacturing came back to me after I finished the > design and was about to ship it and said that they use a conductive epoxy > to adhere the die to the Board and they're worried that if the Solder > Resist has pin holes in it that it could leak a signal into the runners > below those Die. They said they could use Pre-Forms but that would kill > their yeild so they want me to reroute the traces below those die. > Unfortuatley that would be a nightmare and add at least a week to my time. > So can anyone tell me where I can get info to help prove that this won't > be a problem or are they right and there's a good possiblitiy that this > could happen. > > Thank you, > > Greg Bodi > > [log in to unmask] > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################