I am trying to quantify the residues left over after reflow from no clean solder
paste.  We have an omega meter in the facility that gives you an ionic
measurement (resistivity and NaCl/inch).  Is this an adquate measurement?

I am qualifying new pastes, and there is a concern in the ICT area about
residues.  Are there any other alternative methods of quantifying solder paste
flux residues?

-Teo Tijerina

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