T.J., In the January issue of SMT there is an article about what you are looking for. It starts on page 70. If you don't have access to this particular issue let me know and I'll fax it to you. Hope this helps? Thank you, Ron Waugh Manufacturing Engineer SMC, Inc. 1729 Jaggie Fox Way Lexington, KY 40511 Phone: (606) 253-3066 Fax: (606) 254-2870 E-mail: [log in to unmask] -----Original Message----- From: T.J. Baltrusaitis II [mailto:[log in to unmask]] Sent: Monday, February 01, 1999 12:16 PM To: [log in to unmask] Subject: [TN] Solder Paste volume Standards Is there a formula for calculation of optimum solder paste volumes for given endcap or lead configurations if pad size is known? I am in the process of programming vision machines to accept/reject PCBs based on solder volumes. I would like to know also if any standards exist for optimum solder volumes that result in optimum solder filets on IC leads and chip endcaps. I want to start with something easy, like 0805 capacitors and resistors. We currently go by past experience, but would like to standardize solder paste brick volumes for specific components wherever possible. If anyone has any info on this, please respond. Thanks. ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################