Is there a formula for calculation of optimum solder paste volumes for given
endcap or lead configurations if pad size is known? I am in the process of
programming vision machines to accept/reject PCBs based on solder volumes. I
would like to know also if any standards exist for optimum solder volumes that
result in optimum solder filets on IC leads and chip endcaps. I want to start
with something easy, like 0805 capacitors and resistors. We currently go by past
experience, but would like to standardize solder paste brick volumes for
specific components wherever possible. If anyone has any info on this, please
respond. Thanks.

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