Is there a formula for calculation of optimum solder paste volumes for given endcap or lead configurations if pad size is known? I am in the process of programming vision machines to accept/reject PCBs based on solder volumes. I would like to know also if any standards exist for optimum solder volumes that result in optimum solder filets on IC leads and chip endcaps. I want to start with something easy, like 0805 capacitors and resistors. We currently go by past experience, but would like to standardize solder paste brick volumes for specific components wherever possible. If anyone has any info on this, please respond. Thanks. ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################