Hi Designers, I'm in need of help! I have completed a design with some L157 IC's on the Board. And Manufacturing came back to me after I finished the design and was about to ship it and said that they use a conductive epoxy to adhere the die to the Board and they're worried that if the Solder Resist has pin holes in it that it could leak a signal into the runners below those Die. They said they could use Pre-Forms but that would kill their yeild so they want me to reroute the traces below those die. Unfortuatley that would be a nightmare and add at least a week to my time. So can anyone tell me where I can get info to help prove that this won't be a problem or are they right and there's a good possiblitiy that this could happen. Thank you, Greg Bodi [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################