Good Morning Technetters, Thanks for all the help on the board shop for the mil spec multilayer board. I have passed the info on to the powers that be. Today I have a different problem, pertaining to SMT assy and solder paste. We have made a board that has 15 mil pitch, using 8 mil pads connected to 8 mil tracks (some). The problem is that the SMT is cleared on the ends by 5 mils and the track width is pulling the paste from the pad and causing the part not to adhere. What can we do to block the paste from traveling down the track at this point. We have the boards made and would prefer a good rework procedure instead of remaking the boards. Thanks in advance for the assistance. Anne Ledger Mfg. Engineering Dept EMDS, Inc. [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################