Hi All, I would like to get such information,too. -----原始郵件----- 寄件者: Thomas Colombo <[log in to unmask]> 收件者: [log in to unmask] <[log in to unmask]> 日期: 1999年1月22日 AM 02:44 主旨: [TN] Sequential lamination / Via Damming materials >Is anyone working with any via damming materias in sequential lam. other >than the industry standards ie: Senform, packovia, etc. > >______________________________________________________ >Get Your Private, Free Email at http://www.hotmail.com > >################################################################ >TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1. >8c >################################################################ >To subscribe/unsubscribe, send a message to [log in to unmask] with >following text in the body: >To subscribe: SUBSCRIBE TechNet <your full name> >To unsubscribe: SIGNOFF TechNet >################################################################ >Please visit IPC's web site (http://www.ipc.org) "On-Line Services" >section for additional information. >For technical support contact Hugo Scaramuzza at [log in to unmask] or >847-509-9700 ext.312 >################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################