Yes, nice idea! But how do you get maximum support on a complex assembly for the printer without it creating massive heat sinking scenarios which ruin the thermal characterisics of the assembly with regard to reflow. I believe the two are in opposition to each other. Printing requires large mass in the support with as much contact under the board to give adequate support. Reflow requires pallets which have as little contact with the assembly underside as possible, thereby NOT sinking heat from the upper side reflow. I have designed alot of jigs for such purposes, and don't agree with putting the two aspects together. Regards Edward Brunker Senior Process Engineer ______________________________ Reply Separator _________________________________ Subject: Re: [TN] One more thing on Double side reflow Author: <[log in to unmask]> at INTERNET Date: 19/01/99 12:06 Wade, Just a small point, If your are have to use a pallet - use it to the maximum benefit. Often you can (print) place and reflow both top side and bottom side in one hit(dependent on pad pitch). Think about the cost savings! No line changeover No Single side stock Easier product management One stencil One placement program Faster loading (2 times as fast) If you then extend this idea you can do 4,6 and 8 up. If you can get into bed with the pcb manufacturer you can also avoid post routing / break off. The carrier design especially board registration) becomes fairly critical but in Europe this is very popular, and is becoming more so in USA. A small picture of an 8 up can be seen on http://www.datumdynamics.com/smt.htm Please contact myself or Chris Chapman ([log in to unmask](401) 683-5300) if you want any more info. Regards Fin Finlay Buchan Tel +44 (0)1290 426200 Fax +44 (0)1290 426212 Email [log in to unmask] Web Page http://www.datumdynamics.com -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Wade Oberle Sent: Monday, January 18, 1999 3:18 PM To: [log in to unmask] Subject: [TN] One more thing on Double side reflow Andrew, One more thing, we use the same alloy of solder paste on both sides of the board. There has been one board where we had to build heat resistant pallets to support the boards and keep the heat from side 1 when reflowing side2. This was due to the fact that we had many large mass components on both sides of the board. The pallets worked great but they cost $150 each and need periodic repair and are an obstruction to high volume manufacturing. Wade Oberle [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text n the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for ditional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 t.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################