Hi Ryan - There are a bunch of ways to get electronics fully enclosed or encased in plastics, but the heat and pressure of conventional injection molding operations probably exceed what a circuit board assembly with normal components would ever withstand. You're right, CTE would probably add to the problem, if the hardware survived molding and went into a product. Over the years most of us have used a wide variety of electronic grade resins successfully to pot or encapsulate electronic assemblies against all types of environments. Some of this work is done using hard tooling (molds) and some using plastic cases of various descriptions, which become the outer skin of the product. Giving the circuit card assembly a liberal dose of silicone resin before potting can protect it a bit from the outer molding compound, if TCE is expected to be a problem. The silicone cushions, and does not bond to materials other than silicones, without special preparation. Regards - Kelly ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################