Rick pending the environment thermal fluctuation your customer is doomed in field : also the intermetalics build up over time ; making it a real warranty race if somebody chooses (like your customer) to design that way As for the standards and recommendations on flash I found most sensible ITRI's 1.5 um limit (micrometer ; converting to metric all the time ; you have some 40u"to 1um) : check : http://www.itri.co.uk/index.htm ; if I got it right . We keep internal usual 0.3 - 0.5 um ; with 0.8 um inwards limit ; with some 6 months old boards average = no Ni oxide problem . The results on IPC-SM-785 reliability cycling were very good (bloody excellent to be frank, with indium NC-SMQ90[dispensing]) ; keep low on reflow peak . Somebody may correct me ; but I could not find IPC's equivalent on flash recommendation . See you Paul Klasek http://www.resmed.com > ---------- > From: Rick Thompson[SMTP:[log in to unmask]] > Sent: Friday, 29 January 1999 10:48 > To: [log in to unmask] > Subject: [TN] Gold Flash Spec for PCB? > > <<File: Rick Thompson.vcf>> > Hi, > > Can someone recommend IPC or other specs that deal with thickness > specifications for gold flash and/or plating on PCBs? Any other sources of > information or recommendations would be appreciated as well. I have a > customer who needs plated gold for wire bonding but in the interest of > saving money, they've elected to have the entire PCB plated with 80-100 > microinches of gold. This is causing us alot of problems with solder joint > quality in terms of brittleness of the joints. I'm trying to offer them > some > alternatives, but am not that familiar with what's considered "standard". > Any insight would be greatly appreciated. > > Thanks. > > > Rick Thompson > Ventura Electronics Assembly > 2665A Park Center Dr. > Simi Valley, CA 93065 > > +1 (805) 584-9858 voice > +1 (805) 584-1529 fax > [log in to unmask] > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################