Evan said a bunch without saying it all. I am curious about your VOC free experiences as mine have been exciting - though mostly positive under certain conditions. As we're all faced with the prospect of using VOC free, sooner than later, I took notice of your simple statement concerning the need for a different profile (to dry the flux) before the solder pot. I've not been able to simply change make the stuff work as a no clean type. About two years ago, using a retro-fitted (with hot air knives) TD/NuEra machine, we achieved promise removing the oxygen "bubbles" associated with VOC free no clean as part of its water component. Still, there was some concern with appearance as if the no clean didn't - not withstanding mild "explosive" activity causing some solder balling. Using a retro-fitted machine with N2, the result were much better. Using a "from the ground up" machine with N2, everything started coming together. One particular machine offers considerable promise (name witheld) as many others will in time. Evan, could you shed more light on the subject as it is becoming much more important now, Earl Moon ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################